Types of manufacture

-blank production from sheet, round and section materials;
-cutout of sheet materials;
-cutting circular saws and by table shears.

Turning:
• on multi-purpose lathes; • on universal equipment.

Milling:
• on numeric controlled machines(detail dimensions 1000x500x500 mm);
• processing on vertical-milling machining centers HAAS company and gantry milling centers SANCO.

Polishing:
• external surfaces with diameter up to 600 mm.

Assembling, coiling, adjustment of equipment.

Enterprise manufactures specialized hybrid LF, HF and VHF microelectronic and acoustic electronic equipment using thin-film technology.
The production is performed in premises of 6-8 level of clearance according ISO 14644-1.
Manufacture of microelectronic is carried out on the following technologies: 
• spraying of resistive and conductive materials by methods of thermal vacuum evaporation and magnetron sputtering on a substrate of glass ceramic, piezoquartz, ferrite, lithium niobate; 
• manufacture of thin-film boards by methods of photolithography
• galvanization of thin-film boards by electrochemical methods;
• adjustment of thin-film resistors by laser and chemical methods with accuracy +0,5 %.
• diamond and laser processing of substrates for production of boards of  necessary form and holes diameter 0,1 mm;
• forming of metalized holes in boards;
• assembling of microelectronic in specialized and standard frames using gluing, soldering and different types of micro welding;
• adjustment of microelectronic equipment with the withdrawal of parameters in temperature span from  -60⁰ up to +125⁰;
• technological (mechanic, climatic) testing;
• capsulation of units by laser welding and soldering with filling of internal space by inert gas with overpressure and further control of capsulation; 
During production microelectronic equipment passes quality control and factory acceptance tests. Enterprise has all facilities necessary for providing of operations, mentioned above. Following equipment has been purchased by the enterprise: laser micro processing complex “POLYFER”, convection oven chamber type TWS-850,   applying solder paste dispenser SMT-300, welding stations Weller WX1 etc.  
Microelectronic production area is 2200 м² and 800 м² is area the of capsulation zone.